Umshini Oqophayo Wokuqopha Ilaza Ophathwayo we-UV wengilazi yepulasitiki
Ukunemba okuphezulu, isivinini esikhulu, ukusebenza okuzinzile
Ukufinyelela okuhle nokunemba okuphezulu
Ilogo, iphethini, umbhalo we-laser oqoshiwe
I-jade, ingilazi, izitsha zobumba, i-porcelain, i-jade, ipulasitiki, i-silicone, insimbi neminye imikhiqizo eqoshiwe nge-laser
I-Compact Bench-top
3W UV UV Laser Marking Machine
Ukuzinza kokusebenza isikhathi eside, uhlelo lokusebenza lwezimboni ezingama-24/7
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Ukuhamba 400mm
Igama Lomkhiqizo | Umshini Wokumaka we-UV Laser Wengilazi Yepulasitiki |
Laser Amandla | 3W 5W 10W |
I-Laser Wavelength | 355nm |
I-Frequency Range | 40KHz-300KHz |
Ikhwalithi ye-Beam(M2) | M2≤1.2 |
I-Beam Diameter | 0.8±0.1mm |
Ukuzinza kwamandla okumaphakathi | I-RMS≤3%@24 amahora |
Ukusetshenziswa kwamandla okumaphakathi | <250W |
Indawo yokumaka ye-Laser | 50*50mm/110*110mm/150*150mm |
Isivinini sokumaka i-Laser | 2000-15000mm/s |
Imodi Yokupholisa | Ukupholisa umoya/Ukupholisa amanzi |
Okokufaka Amandla | <1000W |
Imfuneko ye-Voltage | 90V-240V 50/60HZ |
Isixhumanisi Esibonakalayo | I-USB |
Ubude bempilo | 100000 amahora |
Idivayisi ozikhethela yona | Izibuko zokuvikela i-laser, i-T-slot, idivayisi ye-Rotary, uJack |
Ifomethi Yomfanekiso Isekelwe | I-AI,PLT,DXF,DWG |
Control Software | JCZ Ezcad |
Isisindo(KG) | 40KG |
Ukucushwa | Ibhentshi-phezulu |
Ukuphila kwedivayisi ye-laser | 100000 amahora |
Imodi yokusebenza | Igagasi Eliqhubekayo |
I-Compact Bench-top
3W UV UV Laser Marking Machine
Ukuzinza kokusebenza isikhathi eside, uhlelo lokusebenza lwezimboni ezingama-24/7
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Ukuhamba 400mm
Umshini wokumaka we-laser we-MavenLaser UV usebenzisa i-355nm ultraviolet laser uthuthukisiwe, umshini usebenzisa i-oda lesithathu le-intracavity frequency double technology uma uqhathaniswa ne-infrared laser, indawo egxilwe kuyo engu-355 UV incane kakhulu, umphumela wokumaka uwukuphazamisa ngokuqondile iketango le-molecular yezinto ngokusebenzisa. i-laser ye-wavelength emfushane, inciphisa kakhulu ukuguqulwa komshini wezinto ezibonakalayo, ukuguqulwa kokushisa (ukukhanya okubandayo), ngoba ikakhulukazi isetshenziselwa Ukumaka okuhle kakhulu, ukuqoshwa, okulungele ukudla, ukumaka izinto zokupakisha zemithi, ukubhoboza imbobo encane, ephezulu. -Ukuhlukaniswa kwesivinini sezinto zengilazi kanye nokusikwa kwehluzo eziyinkimbinkimbi zama-silicon wafers nezinye izimboni zohlelo lokusebenza. Inkampani yethu isebenzisa ubuchwepheshe obuthuthukisiwe bamazwe ngamazwe, i-UV laser impontshwa ngamandla aphezulu we-multi-mode laser diode ukuze ikhiqize i-laser bese iphindaphinda i-laser beam ye-UV, bese ngokulawula ikhompuyutha yokuphambuka kwesibuko sokuskena ngesivinini esikhulu ukushintsha indlela ye-laser optical beam. ukuze kuzuzwe ukumaka okuzenzakalelayo.