Ubuchwepheshe bokuhlanza nge-laserkuyindlela ephumelelayo yokusebenzisa ubuchwepheshe be-laser emkhakheni wobunjiniyela. Isimiso sayo esiyisisekelo sisebenzisa amandla aphezulu e-laser ukuze sikwazi ukusebenzisana phakathi kwemisebe ye-laser kanye nokungcola okunamathela kuma-substrate omsebenzi. Ukungcola kuhlukaniswa kuma-substrate ngokwandiswa kokushisa okusheshayo, ukuncibilika, ukuguquguquka kwegesi kanye nezinye izindlela. Njengoba kuqhakambisa ukusebenza kahle okuphezulu, ubungane bemvelo kanye nokonga amandla, ubuchwepheshe bokuhlanza i-laser busetshenziswe ngempumelelo ekuhlanzeni isikhunta samasondo, ukususa upende womzimba wendiza, ukubuyiselwa kwezinto zamasiko kanye neminye imikhakha.
Ubuchwepheshe bokuhlanza bendabuko buhlanganisa ukuhlanza ukungqubuzana kwemishini (ukuqhuma kwesihlabathi, ukuhlanza ijethi yamanzi ngomfutho ophezulu, njll.), ukuhlanza ukugqwala ngamakhemikhali, ukuhlanza nge-ultrasonic, ukuhlanza iqhwa elomile nokuningi. Lobu buchwepheshe busetshenziswa kabanzi kuzo zonke izimboni. Isibonelo, ukuqhuma kwesihlabathi kungasusa amabala okugqwala kwensimbi, ama-surface burrs kanye nezingubo ezihlanganisiwe emabhodini wesekethe ngokukhetha izinto ezisusa ubulukhuni obuhlukahlukene. Ukuhlanza ukugqwala ngamakhemikhali kusetshenziswa kakhulu ekususweni kwesikali samafutha angaphezulu kwemishini, ukuhlanza isikali sebhoyila kanye nokuvula ipayipi lamafutha. Nakuba sekuvuthiwe, izindlela zendabuko zinezinkinga eziphawulekayo: ukuqhuma kwesihlabathi kulimaza kalula izindawo ezilungisiwe, kanti ukuhlanza ukugqwala ngamakhemikhali kubangela ukungcola kwemvelo futhi kungalimaza ama-substrate uma kungasetshenziswanga kahle. Ukuvela kokuhlanza nge-laser kuphawula inguquko kubuchwepheshe bokuhlanza. Ukusebenzisa amandla aphezulu e-laser, ukunemba kanye nokudlulisela okusebenzayo, ukuhlanza nge-laser kuphumelela kakhulu kunezindlela zendabuko ekusebenzeni kahle kokuhlanza, ukunemba kanye nokubeka. Kuqeda ukungcola kwemvelo okuvela ekuhlanzweni ngamakhemikhali futhi akubangeli monakalo kuma-substrate.
Izimiso Zokuhlanza Nge-Laser
Kuyini ngempela ukuhlanza nge-laser? Kubhekisela enkambisweni yokususa izinto ezindaweni eziqinile (noma ngezinye izikhathi eziwuketshezi) ngokusebenzisa imisebe ye-laser. Ekukhanyeni okuphansi kwe-laser, amandla e-laser amuncwayo afudumeza izinto, okubangela ukuhwamuka noma i-sublimation. Ekukhanyeni okuphezulu kwe-laser, izinto zivame ukuguqulwa zibe yi-plasma. Ukuhlanza nge-laser kuvame ukusebenzisa ama-laser ashukunyiswayo ukuze kususwe izinto, yize imisebe ye-laser eqhubekayo ingasusa izinto ngamandla anele. Ama-laser e-deep ultraviolet excimer, anama-wavelengths azungeze ama-200 nm, asetshenziswa kakhulu ekukhanyeni kwe-photoablation.
Ukujula kweamandla e-laserukumuncwa kanye nenani lezinto ezisusiwe nge-pulse ngayinye kuncike ezicini ezibonakalayo zezinto, kanye nobude be-laser kanye nobude be-pulse. Isisindo esiphelele esisusiwe kusuka ekuhlosweni nge-pulse ngayinye sichazwa njengesilinganiso se-ablation. Izici zomsebe we-laser ezifana nesivinini sokuskena kanye nokumbozwa komugqa kuthonya kakhulu inqubo ye-ablation.
Izinhlobo Zobuchwepheshe Bokuhlanza Nge-Laser
1) Ukuhlanza Komile Nge-Laser
Ukuhlanza okomile nge-laser kuhilelaukukhanyiswa kwe-laser okuqondile kwezingxenye zokusebenza. Izinto ezingcolisayo noma izinto ezingaphansi komhlaba zimunca amandla e-laser, ziphakamisa izinga lokushisa lazo futhi zibangele ukwanda kokushisa noma ukudlidliza kokushisa kwe-substrate, okuhlukanisa izinto ezingcolisayo nezinto ezingaphansi komhlaba. Kwenzeka ezimweni ezimbili: noma izinto ezingcolisayo ezingaphezulu komhlaba zimunca amandla e-laser futhi zande, noma izinto ezingaphansi komhlaba zimunca amandla futhi zidlidlize ngokushisa.
Ngo-1969, u-SM Bedair nabanye bathola ukuthi ukwelashwa okujwayelekile kwendawo (ukwelashwa ngokushisa, ukugqwala kwamakhemikhali, ukuqhuma kwesihlabathi) konke kwakunemikhawulo. Baphawula ukuthi ubuningi bamandla aphezulu be-laser egxile kungenza izinto ezingaphansi komhlaba zibe nombala oshintshashintshayo ngaphandle kokulimaza i-substrate. Ukuhlolwa kwaqinisekisa ukuthi i-laser ye-ruby eshintshiwe ye-Q enamandla angu-30 MW/cm² ingahlanza ukungcola ezindaweni ze-silicon ngaphandle kokulimala kwe-substrate, okuphawula ukuqaliswa kokuqala kokuhlanza okomile kwe-laser.
Izinga lokuhlanza lilonke lingabonakaliswa ngesilinganiso sokususwa kwemfucumfucu yefilimu, njengoba kuboniswe ngezansi:
(Ifomula: ε—inkomba yamandla okushaya kwe-laser; h—inkomba yokujiya kwefilimu engcolile; inkomba ye-modulus elastic yefilimu ye-E)
2) Ukuhlanza Okumanzi Nge-Laser
Ngaphambi kokushiswa ngemisebe ye-laser evunguzayo, ifilimu ewuketshezi ifakwa ngaphambili ebusweni be-workpiece. Amandla e-laser ayashisa futhi ashise ifilimu ngokushesha, akhiqize i-shockwave esheshayo esusa izinhlayiya ezingcolile ku-substrate. Le ndlela ayidingi ukusabela kwamakhemikhali phakathi kwe-substrate nefilimu ewuketshezi, inciphisa izinto zayo ezisebenzayo.
Ngo-1991, u-K. Imen nabanye babhekana nokungcola okusele kwe-submicron kuma-wafers e-semiconductor kanye nezinsimbi ngemva kokuhlanza okuvamile. Bamboza ama-substrates ngefilimu emunca i-laser futhi bayikhanyisa nge-laser ye-CO₂. Ifilimu yamunca amandla, yafudumala ngokushesha, yabila futhi yashiswa ngokuqhuma, yasusa ukungcola okungaphezulu—lokhu kuchaza ukuhlanzwa okumanzi nge-laser.
3) Ukuhlanza i-Laser Plasma Shockwave
Ama-shockwave e-plasma e-laser akheka lapho ama-laser enza umoya ube ama-shockwave e-plasma ayindilinga ngesikhathi sokukhanya. Lawa ma-shockwave ashaya ama-substrate, akhipha amandla okususa ukungcola ngaphandle kokulimaza i-substrate (ama-laser awahlangani ngqo nama-substrate). Lobu buchwepheshe buhlanza izinhlayiya ezincane njenge-nanometers ezingamashumi futhi abubeki mingcele kubude be-laser.
Izimiso zomzimba zokuhlanza i-plasma zifingqiwe kanje:
a) Imisebe ye-laser imuncwa ungqimba olungcolile olusebusweni obuqondiwe.
b) Ukumuncwa kwamandla aphezulu kwakha i-plasma ekhula ngokushesha (igesi engazinzile ene-ionized kakhulu), edala amaza okwethuka.
c) Amaza omlilo ahlukanisa futhi asuse ukungcola.
d) Ama-pulse e-laser kumele abe mafushane ngokwanele ukuze kugwenywe ukunqwabelana kokushisa okulimaza i-substrate.
e) Ukuhlolwa kubonisa amafomu e-plasma ezindaweni zensimbi lapho kukhona ama-oxide.
Ukukhiqizwa kwe-plasma kwenzeka kuphela ngaphezu komkhawulo wobuningi bamandla, okuncike kungqimba olungcolile noma lwe-oxide okufanele lususwe. Kukhona umkhawulo wesibili ophezulu, lapho i-substrate yonakaliswa khona. Ukuqinisekisa ukuhlanzwa okuphumelelayo ngaphandle kokulimala kwe-substrate, amapharamitha e-laser kumele alungiswe ukuze kugcinwe ubuningi bamandla e-pulse phakathi kwemingcele emibili.
Ngo-2001, u-JM Lee nabanye basebenzisa ama-plasma shockwaves avela kuma-laser agxile kakhulu. I-laser evuvukile enamandla angu-2.0 J/cm² (edlula kakhulu umkhawulo womonakalo we-silicon) yakhanyisa ama-silicon wafers ngasikhathi sinye, yasusa ngempumelelo izinhlayiya ze-tungsten eziyi-1 μm. Empeleni, ukuhlanza ama-plasma shockwave nge-laser kuyingxenye yokuhlanza okomile.
Ekuqaleni yathuthukiswa ukususa izinhlayiya ezincane kakhulu kuma-wafer e-semiconductor, lobu buchwepheshe obuthathu bokuhlanza nge-laser buye banda baba ukuhlanza isikhunta samasondo, ukususwa kopende wesikhumba sendiza, ukubuyiselwa kwezinto ezisele zamasiko nokuningi. Igesi engasebenzi ingapheshulwa ezisekelweni ngesikhathi sokukhanya nge-laser ukuze kususwe ngokushesha ukungcola okuhlukanisiwe, kuvimbele ukungcola kanye nokubola.
Ukusetshenziswa Kobuchwepheshe Bokuhlanza Nge-Laser
1) Imboni Yama-Semiconductor: Ukuhlanzwa Kwama-Semiconductor Wafers kanye Nama-Optical Substrates
Ama-wafer e-semiconductor kanye nama-substrate e-optical adlula ezinyathelweni ezifanayo zokucubungula (ukusika, ukugaya) ukuze akhe izimo ezifiselekayo, ethula ukungcola okunzima ukukususa futhi okuvame ukungcoliswa. Ukungcola kuma-wafer kuphazamisa ikhwalithi yokuphrinta kwesekethe futhi kufinyeze isikhathi sokuphila sama-chip. Kuma-substrate e-optical, kwehlisa ukusebenza kwedivayisi ye-optical kanye ne-coating, okubangela ukusatshalaliswa kwamandla okungalingani kanye nokuphila kwenkonzo okuncishisiwe.
Ukuhlanza okomile nge-laser akuvamile ukusetshenziswa lapha ngenxa yezingozi zokulimala kwe-substrate, kuyilapho ukuhlanza okumanzi kanye nokuhlanza i-plasma shockwave kunezinhlelo eziningi eziphumelelayo. U-Xu Chuanyi nabanye bafaka upende we-magnetic we-micron-scale njengefilimu ye-dielectric kuma-substrate abushelelezi kakhulu, kwafezwa ukuhlanza kwe-laser okusebenzayo okuqhutshwa yi-pulsed. Nakuba izinhlayiya zokungcola okuphelele zanda, usayizi wazo kanye nokumbozwa kwazo kwehle kakhulu. UZhang Ping wafunda imiphumela yebanga lokusebenza kanye namandla e-laser ekusebenzeni kahle kokuhlanza kwezinhlayiya ezinobukhulu obuhlukahlukene. Ukuhlolwa kubonise ukuthi i-laser engu-240 mJ ithole ukuhlanzwa okuhle kakhulu kwezinhlayiya ze-polystyrene engilazini eqhubayo ebangeni lokusebenza elingu-1.90 mm. Ukusebenza kahle kokuhlanza kuthuthukiswe ngamandla aphezulu e-laser, futhi izinhlayiya ezinkulu zazilula ukuzisusa.
2) Imboni Yensimbi: Ukuhlanza Ingaphezulu Lensimbi
Ukuhlanza ubuso bensimbi kuhlose izinto ezingcolisa kakhulu: izendlalelo ze-oxide/rust, upende, izinto zokumboza nezinye izinto ezinamathiselwe, ezihlukaniswe njengezingcolisa eziphilayo (upende, izinto zokumboza) noma ezingaphili (ukumboza). Ukuhlanza kuhlangabezana nezidingo ezilandelayo zokucubungula/zokusebenzisa: isib., ukususa izendlalelo ze-oxide ezingama-10 μm ubukhulu kuma-alloy e-titanium ngaphambi kokushisela, ukususa upende ezikhumbeni zezindiza ukuze kupendwe kabusha, kanye nokuhlanza izinsalela zerabha ezikhumbeni zamathayi ukuqinisekisa ikhwalithi yomkhiqizo kanye nesikhathi sokuphila kwesikhunta.
Izinsimbi zinemingcele ephezulu yomonakalo kunemingcele yazo yokuhlanza engcolile, okuvumela ukuhlanza okuphumelelayo ngama-laser asebenza kahle. Ukusetshenziswa okuvuthiwe kufaka phakathi: UWang Lihua nabanye babonise ukuthi i-laser engu-5.1 J/cm² isuse izendlalelo ze-oxide ku-A5083-111H aluminium alloy ngenkathi igcina ikhwalithi ye-substrate, kanye ne-laser engu-100 W pulsed ehlanze ngempumelelo izendlalelo ze-titanium alloy oxide kanye nokuqina okuphezulu kwendawo. Abakhiqizi basekhaya (uRaycus Laser, uHan's Laser, uShenzhen Chuangxin) bahlinzeka kabanzi ngemishini yokuhlanza i-laser yezinhlobo zerabha, ukugqwala kwensimbi kanye nokususwa kwamafutha ezingxenyeni.
3) Ukulondolozwa Kwezinto Eziyigugu Zamasiko: Ukuhlanzwa Kwezinto Eziyigugu Zamasiko Nezinto Eziyigugu Zephepha
Izinto ezisetshenzisiwe zensimbi namatshe ziqoqa ukungcola, amabala ayinki kanye nezinye izinto ezingcolisayo ngokuhamba kwesikhathi, okudinga ukususwa ukuze kubuyiselwe ukubukeka kwasekuqaleni. Izinto ezenziwe ngephepha (imidwebo, ukubhala ngobuciko) zikhiqiza isikhunta kanye nama-plaque ngesikhathi sokugcinwa okungafanele, okonakalisa kakhulu isimo sazo kanye nenani lamasiko/lomlando.
UZhao Ying nabanye baqinisekisile ukuhlanzwa kwe-UV nge-laser kwama-mold plaque ephepheni lelayisi: ukuskena okukodwa ku-3.2 J/mm² kususe ama-plaque amancane, kuyilapho ukuskena okubili kuthole ukususwa okuphelele; amandla e-laser amaningi alimaze iphepha. UZhang Xiaotong wabuyisela ngempumelelo into yobuciko yethusi eqoshiwe esebenzisa indlela yokumanzi nge-laser. UZhang Licheng wasebenzisa ukuhlanzwa nge-laser esithombeni sobumba sowesifazane esidwetshwe ngopende esivela eHan Dynasty. UYuan Xiaodong nabanye bahlole ukusebenza kahle kokuhlanzwa nge-laser kwama-relic amatshe, beqhathanisa umonakalo we-substrate kanye nokusebenza kahle kokususa amabala e-inki, intuthu kanye nopende esihlabathini.
Isiphetho
Ukuhlanza nge-laser ubuchwepheshe obuthuthukisiwe obunocwaningo olubanzi kanye namathuba okusetshenziswa ezindiza, imishini yezempi, izinto zikagesi kanye neminye imikhakha enembile kakhulu. Njengoba ivuthiwe ezimbonini eziningi ngenxa yokusebenza kwayo kahle, ubungane bemvelo kanye nemiphumela yokuhlanza ephezulu, ukusetshenziswa kwayo kuyaqhubeka nokukhula. Ngale kokususwa kopende nokugqwala okusunguliwe, intuthuko yakamuva ifaka phakathi ukuhlanzwa nge-laser kwezingqimba ze-oxide ezintanjeni zensimbi. Intuthuko yesikhathi esizayo incike ekwandiseni izinhlelo zokusebenza ezikhona, ukungena emasimini amasha kanye nokuthuthukisa imishini:
- Qinisa ucwaningo lwethiyori ukuze luqondise ukusetshenziswa okungokoqobo. Ucwaningo lwamanje luthembele kakhulu ekuhlolweni, lungenalo uhlaka lwethiyori oluvuthiwe. Ukusungula uhlaka olunjalo kubalulekile ekuvuthweni kobuchwepheshe.
- Nweba izinhlelo zokusebenza emasimini akhona nasanda kwakhiwa. Ukusetshenziswa okusha okusetshenziswayo kuhlanganisa ukuhlanza i-metal wire oxide, okuhlinzeka ngendawo evundile yokukhula.
- Thuthukisa imishini emisha yokuhlanza nge-laser, ehlukahlukene ibe amadivayisi asetshenziswa kabanzi (isb., ukususa upende/ukugqwala okuhlanganisiwe) kanye namathuluzi akhethekile (isb., izinto ezenziwe ngokwezifiso/imicu yezindawo ezivalekile). Ukuzenzakalela okugcwele ngokuhlanganiswa namarobhothi ezimboni kuyisiqondiso esithembisayo.
Isikhathi sokuthunyelwe: Meyi-14-2026
