Isimiso, izinhlobo kanye nokusetshenziswaukuhlanzwa nge-laserubuchwepheshe
Ubuchwepheshe bokuhlanza i-laser buyindlela ephumelelayo yokusebenzisa ubuchwepheshe be-laser emkhakheni wobunjiniyela. Isimiso sawo esiyisisekelo ukusebenzisa amandla amaningi e-laser ukuze kuhlangatshezwane nokungcola okunamathela ku-substrate yento yokusebenza, okubangela ukuba kuhlukane ne-substrate ngendlela yokwanda kokushisa okusheshayo, ukuncibilika, kanye nokuhwamuka kwegesi. Ubuchwepheshe bokuhlanza i-laser bubonakala ngokusebenza kahle kakhulu, ubungane nemvelo, kanye nokonga amandla. Busetshenziswe ngempumelelo emikhakheni efana nokuhlanza isikhunta samasondo, ukususwa kopende womzimba wendiza, kanye nokuvuselelwa kwezinsalela zamasiko.
Ubuchwepheshe bokuhlanza bendabuko buhlanganisaukuhlanza ukungqubuzana komshini(ukuhlanza i-sandblasting, ukuhlanza i-jet yamanzi ngomfutho ophezulu, njll.), ukuhlanza ukugqwala kwamakhemikhali, ukuhlanza nge-ultrasonic, ukuhlanza iqhwa elomile, njll. Lobu buchwepheshe bokuhlanza busetshenziswe kabanzi ezimbonini ezahlukene. Isibonelo, ukuhlanza i-sandblasting kungasusa amabala okugqwala kwensimbi, ama-burrs ensimbi, kanye ne-varnish ene-proof ezintathu emabhodini wesekethe ngokukhetha izinto ezisusayo ezinobunzima obuhlukene. Ubuchwepheshe bokuhlanza ukugqwala kwamakhemikhali busetshenziswa kabanzi ekuhlanzeni amabala kawoyela ezindaweni zemishini, esikalini kuma-boiler, nasemapayipini kawoyela. Nakuba lobu buchwepheshe bokuhlanza sebuthuthukiswe kahle, busenezinkinga ezithile. Isibonelo, ukuhlanza i-sandblasting kungabangela kalula umonakalo endaweni elungisiwe, kanti ukuhlanza ukugqwala kwamakhemikhali kungabangela ukungcola kwemvelo kanye nokugqwala kwendawo ehlanziwe uma kungaphathwanga kahle. Ukuvela kobuchwepheshe bokuhlanza nge-laser kumelela inguquko kubuchwepheshe bokuhlanza. Kusebenzisa amandla aphezulu, ukunemba okuphezulu, kanye nokudluliselwa kwamandla e-laser ngempumelelo, futhi kunezinzuzo ezisobala ngaphezu kobuchwepheshe bokuhlanza bendabuko maqondana nokusebenza kahle kokuhlanza, ukunemba kokuhlanza, kanye nendawo yokuhlanza. Kungagwema ngempumelelo ukungcola kwemvelo okubangelwa ukuhlanza ukugqwala kwamakhemikhali kanye nobunye ubuchwepheshe bokuhlanza, futhi ngeke kubangele umonakalo endaweni engaphansi.
Ngakho-ke kuyini ukuhlanzwa nge-laser? Ukuhlanzwa nge-laser kuyinqubo lapho kusetshenziswa khona umsebe we-laser ukususa izinto ebusweni bento eqinile (noma ngezinye izikhathi uketshezi). Ekugelezeni kwe-laser okuphansi, izinto zishiswa ngamandla e-laser adonswayo bese ziyahwamuka noma zincibilike. Ekugelezeni kwe-laser ephezulu, izinto zivame ukuphenduka i-plasma. Ngokuvamile, ukuhlanzwa nge-laser kubhekisela ekususeni izinto kusetshenziswa ama-laser adonswayo, kodwa uma ukuqina kwe-laser kuphakeme ngokwanele, umsebe we-laser oqhubekayo ungasetshenziselwa ukususa izinto. I-laser ye-excimer yokukhanya okujulile kwe-ultraviolet isetshenziswa kakhulu ekugezeni okukhanyayo. Ubude be-laser obusetshenziselwa ukugezeni okukhanyayo bungaba ngu-200nm. Ukujula kokumuncwa kwamandla e-laser kanye nenani lezinto ezisuswe yi-laser pulse eyodwa kuncike ezimpahleni zokukhanya zezinto, kanye nobude be-laser kanye nobude be-pulse. Isisindo esiphelele esisuswe esiqondisweni yi-laser pulse ngayinye ngokuvamile sibizwa ngokuthi izinga lokusha. Ijubane lokuskena lomsebe we-laser kanye nokumbozwa komugqa wokuskena, njll., kuzothinta kakhulu inqubo yokusha.
Izinhlobo Zobuchwepheshe Bokuhlanza Nge-Laser
1) Ukuhlanza okomile nge-laser: Ukuhlanza nge-laser eyomile kubhekisela ekukhanyeni okuqondile kwengxenye yokusebenza yokuhlanza yi-laser evunguzayo, okubangela ukuthi ukungcola kwesisekelo noma kwendawo kubambe amandla futhi kukhuphuke izinga lokushisa, okuholela ekukhuleni kokushisa noma ekudlidlizeni kokushisa kwesisekelo, ngaleyo ndlela kuhlukanise lokhu kokubili. Le ndlela ingahlukaniswa cishe ngezimo ezimbili: esinye ukuthi ukungcola kwendawo kubamba amandla e-laser futhi kwande; esinye ukuthi isisekelo sibamba amandla e-laser futhi sikhiqize ukudlidliza kokushisa. Ngo-1969, u-SM Bedair nabanye bathola ukuthi izindlela ezahlukene zokwelapha indawo njengokwelashwa kokushisa, ukugqwala kwamakhemikhali, kanye nokuhlanza nge-sandblasting konke kunezinkinga ezahlukene. Ngesikhathi esifanayo, ukuminyana kwamandla aphezulu ngemva kokugxila nge-laser kungenza ukuthi kwenzeke ukuhwamuka kwendawo yezinto ezibonakalayo, okwenza kube nokwenzeka ukuhlanzwa kwendawo yezinto ezibonakalayo okungonakalisi. Ngokusebenzisa izivivinyo, kwatholakala ukuthi ukusebenzisa i-laser e-ruby Q-switched enamandla angu-30 MW/cm2 kungafeza ukuhlanzwa kokungcola kwendawo yezinto ze-silicon ngaphandle kokulimaza isisekelo, futhi okokuqala, ukuhlanzwa kokungcola kwendawo yezinto ezibonakalayo nge-laser kwaqashelwa. Izinga lilonke lingabonakaliswa ngesilinganiso sokuhlukaniswa kwezingcezu zesendlalelo sefilimu, kanje:
Kule fomula, i-ε imele inkomba yamandla okushaya kwe-laser, i-h imele inkomba yobukhulu besendlalelo sefilimu engcolile, kanti i-E imele inkomba ye-modulus elastic yesendlalelo sefilimu.
2) Ukuhlanzwa Okumanzi Nge-Laser: Ngaphambi kokuba umsebenzi ozohlanzwa uvezwe ku-laser evuvukile, kufakwa ifilimu yoketshezi emboza ubuso. Ngaphansi kwesenzo se-laser, izinga lokushisa lefilimu yoketshezi likhuphuka ngokushesha futhi liphele. Ngesikhathi sokuhwamuka, kukhiqizwa igagasi lomthelela, elisebenza ezinhlayiyeni ezingcolisayo futhi libangele ukuba zisuke ku-substrate. Le ndlela idinga ukuthi i-substrate nefilimu yoketshezi zingabelani, ngaleyo ndlela kuncishiswe ububanzi bezinto ezisebenzayo. Ngo-1991, u-K. Imen nabanye babhekana nenkinga yokungcola kwezinhlayiya ezingaphansi kwe-micron ezisele ebusweni be-semiconductor wafers nezinto zensimbi ngemuva kokusetshenziswa kwezindlela zokuhlanza zendabuko, futhi bafunda ukusetshenziswa kokumboza ifilimu ebusweni be-substrate yezinto ezibonakalayo ezingamunca kahle amandla e-laser. Ngemva kwalokho, besebenzisa i-laser ye-CO2, ifilimu yamunca amandla e-laser futhi yanda ngokushesha ekushiseni futhi yabila, yakhiqiza ukuhwamuka okuqhumayo, okwasusa ukungcola ebusweni be-substrate. Le ndlela yokuhlanza ibizwa ngokuthi i-laser wet cleaning.
3) Ukuhlanzwa Kwamagagasi Okushaqisayo Kwe-Laser Plasma: Amagagasi okushaqisayo kwe-laser plasma akhiqizwa lapho i-laser ikhanyisa indawo yomoya futhi ibangele ukwakheka kwegagasi lokushaqisayo kwe-plasma eliyindilinga. Igagasi lokushaqisayo lisebenza ebusweni bento yokusebenza ukuze ihlanzwe futhi likhiphe amandla okususa ukungcola. I-laser ayisebenzi phezu kwe-substrate, ngaleyo ndlela ingabangeli umonakalo ku-substrate. Ubuchwepheshe bokuhlanza amagagasi okushaqisayo kwe-laser plasma manje bungahlanza izinhlayiya ezinobubanzi obungamashumi amaningana ama-nanometer, futhi akukho mingcele kubude be-laser. Isimiso somzimba sokuhlanza i-plasma singafingqwa kanje: a) Ugongolo lwe-laser olukhishwa yi-laser lumuncwa ungqimba lokungcola ebusweni obuphathwe. b) Inani elikhulu lokumuncwa lakha i-plasma ekhula ngokushesha (igesi engazinzile ene-ionized kakhulu) futhi likhiqiza igagasi lomthelela. c) Igagasi lomthelela libangela ukungcola ukuthi kuqhekeke futhi kususwe. d) Ububanzi be-pulse ye-pulse yokukhanya kumele bube bufushane ngokwanele ukugwema ukuqongelela kokushisa okungalimaza ubuso obuphathwe. e) Ukuhlolwa kubonise ukuthi uma kukhona ama-oxide ebusweni bensimbi, i-plasma ikhiqizwa ebusweni bensimbi. I-Plasma ikhiqizwa kuphela uma ubuningi bamandla budlula umkhawulo, okuncike kungqimba lokungcola olususiwe noma ungqimba lwe-oxide. Lo mphumela womkhawulo ubaluleke kakhulu ekuhlanzeni okuphumelelayo ngenkathi kuqinisekiswa ukuphepha kwezinto ze-substrate. Ukubonakala kwe-plasma nakho kunomkhawulo wesibili. Uma ubuningi bamandla budlula lo mkhawulo, izinto ze-substrate zizolimala. Ukuze kwenziwe ukuhlanza okuphumelelayo ngenkathi kuqinisekiswa ukuphepha kwezinto ze-substrate, amapharamitha e-laser kumele alungiswe ngokwesimo ukuqinisekisa ukuthi ubuningi bamandla be-pulse yokukhanya buphakathi kwemingcele emibili. Ngo-2001, u-JM Lee nabanye basebenzisa isici sokuthi ama-laser anamandla aphezulu akhiqiza amaza okushaqeka kwe-plasma lapho egxile, futhi basebenzisa i-laser ye-pulse enobukhulu bamandla obungu-2.0 J/cm2 (obuphakeme kakhulu kunomkhawulo womonakalo wama-wafer e-silicon) ukuze ikhanyise ngokuhambisana ne-wafer ye-silicon, ihlanza ngempumelelo izinhlayiya ze-tungsten eziyi-1 μm ezifakwe ebusweni be-wafer ye-silicon. Le ndlela yokuhlanza ibizwa ngokuthi ukuhlanza amaza okushaqeka kwe-plasma nge-laser, futhi uma sikhuluma ngokuqinile, ukuhlanza amaza okushaqeka kwe-laser nge-laser kuwuhlobo lokuhlanza i-laser eyomile. Inhloso yokuqala yalezi zindlela ezintathu zokuhlanza nge-laser kwakuwukuhlanza izinhlayiya ezincane ebusweni be-semiconductor wafers. Kungashiwo ukuthi ubuchwepheshe bokuhlanza nge-laser bavela ngokuthuthukiswa kobuchwepheshe be-semiconductor. Kodwa-ke, ubuchwepheshe bokuhlanza nge-laser busetshenziswa njalo kwezinye izinkambu, njengokuhlanza isikhunta samasondo, ukususwa kopende wesikhumba sendiza, kanye nokubuyiselwa kobuso bezinto ezidaliwe. Ngenkathi ingaphansi kwemisebe ye-laser, igesi engasebenzi ingapheshulwa ebusweni be-substrate. Lapho ukungcola kuhlutshulwa ebusweni, kuzopheshulwa ngokushesha ebusweni yigesi ukuze kugwenywe ukungcola kabusha kanye nokushiswa kobuso.
Iukusetshenziswa kobuchwepheshe bokuhlanza nge-laser
1) Ensimini ye-semiconductor, ukuhlanzwa kwama-wafer e-semiconductor kanye nama-substrate e-optical kuhilela inqubo efanayo, okuwukucubungula izinto zokusetshenziswa zibe yizimo ezidingekayo ngokusika, ukugaya, njll. Phakathi nale nqubo, kungeniswa ukungcola kwezinhlayiya, okunzima ukuzisusa futhi kubangele izinkinga ezinkulu zokungcola eziphindaphindwayo. Ukungcola okusebusweni bama-wafer e-semiconductor kungathinta ikhwalithi yokuphrinta kwebhodi lesifunda, ngaleyo ndlela kufinyeze isikhathi sokuphila sama-chip e-semiconductor. Ukungcola okusebusweni bama-substrate e-optical kungathinta ikhwalithi yamadivayisi e-optical kanye nezingubo, futhi kungaholela ekusabalalisweni kwamandla okungalingani, kufinyeze isikhathi sokuphila. Njengoba ukuhlanza okomile nge-laser kuthambekele ekudaleni umonakalo ebusweni be-substrate, le ndlela yokuhlanza ayisetshenziswa kakhulu ekuhlanzweni kwama-wafer e-semiconductor kanye nama-substrate e-optical. Ukuhlanza okumanzi nge-laser kanye nokuhlanza amagagasi e-shock plasma nge-laser kunezinhlelo zokusebenza eziphumelela kakhulu kule nsimu. U-Xu Chuanyi nabanye bafunde ukufakwa kopende olukhethekile lwe-magnetic oluncane kakhulu ebusweni be-substrate e-optical ebushelelezi kakhulu njengefilimu ye-dielectric, base besebenzisa i-laser e-pulsed yokuhlanza. Umphumela wokuhlanza wawumuhle, yize inani lezinhlayiya zokungcola endaweni ngayinye likhuphukile, usayizi nendawo yokumboza kwezinhlayiya zokungcola kuncishisiwe kakhulu. Le ndlela ingahlanza ngempumelelo izinhlayiya zokungcola ezincane ebusweni bezinto ezibushelelezi kakhulu. UZhang Ping wafunda ithonya lebanga lokusebenza kanye namandla e-laser emphumeleni wokuhlanza wezinto ezingcolisayo zosayizi wezinhlayiya ezahlukene kubuchwepheshe bokuhlanza i-laser plasma. Imiphumela yokuhlola ibonise ukuthi ngezinhlayiya ze-polystyrene ezingaphansi kwengilazi eqhubayo, ibanga lokusebenza elifanele lamandla angu-240 mJ lalingu-1.90 mm. Njengoba amandla e-laser ekhula, umphumela wokuhlanza wathuthuka kakhulu, futhi izinto ezinkulu ezingcolisayo zazilula ukuzihlanza.
2) Ensimini yezinto zensimbi, ukuhlanzwa kwezindawo zensimbi kuhlukile ekuhlanzweni kwama-wafer e-semiconductor kanye nama-substrate e-optical. Izinto ezingcolisayo okufanele zihlanzwe zingaphansi kwesigaba se-macroscopic. Izinto ezingcolisayo ebusweni bezinto zensimbi zifaka phakathi ungqimba lwe-oxide (ungqimba lokugqwala), ungqimba lopende, uqweqwe, nezinye izinamathiselo, futhi zingahlukaniswa zibe izinto ezingcolisayo eziphilayo (njengengqimba lopende, uqweqwe) kanye nezinto ezingcolisayo ezingaphili (njengengqimba lokugqwala). Ukuhlanzwa kwezinto ezingcolisayo ebusweni bezinto zensimbi kuhloswe kakhulu ukuhlangabezana nezidingo zokucubungula noma ukusebenzisa okulandelayo, njengokususa cishe ungqimba lwe-oxide oluyi-10 μm ebusweni bezingxenye ze-titanium alloy ngaphambi kokushisela, ukususa uqweqwe lopende lokuqala ebusweni besikhumba ngesikhathi sokulungiswa okukhulu kwendiza ukuze kube lula ukufutha kabusha, kanye nokuhlanza njalo izinhlayiya zerabha ezinamathele ku-mold yethayi lerabha ukuqinisekisa ukuhlanzeka kobuso kanye nekhwalithi kanye nokuphila kwesikhathi se-mold. Umkhawulo womonakalo wezinto zensimbi uphakeme kunomkhawulo wokuhlanza we-laser wezinto ezingcolisayo ebusweni bazo. Ngokukhetha i-laser yamandla afanele, umphumela wokuhlanza ongcono ungatholakala. Lobu buchwepheshe busetshenziswe ngendlela evuthiwe kwezinye izinkambu. UWang Lihua nabanye bafunde ukusetshenziswa kobuchwepheshe bokuhlanza nge-laser ekwelapheni izikhumba ze-oxide ebusweni be-aluminium alloys kanye ne-titanium alloys. Imiphumela yocwaningo ibonise ukuthi ukusebenzisa i-laser enamandla angu-5.1 J/cm2 kungahlanza ungqimba lwe-oxide ebusweni be-aluminium alloy ye-A5083-111H ngenkathi kugcinwa ikhwalithi enhle ye-substrate, futhi ukusebenzisa i-pulsed laser enamandla aphakathi angu-100 W ngendlela yokuskena kungahlanza ngempumelelo ungqimba lwe-oxide ebusweni be-titanium alloys futhi kuthuthukise ubulukhuni bomphezulu wezinto ezibonakalayo. Izinkampani zasekhaya ezifana neRuike Laser, iDaqu Laser, kanye neShenzhen Chuangxin zithuthukise imishini yokuhlanza nge-laser esetshenziswe kabanzi ekuhlanzeni isikhunta senjoloba njengamathayi, izendlalelo zokugqwala kwensimbi, kanye namabala kawoyela ebusweni bezingxenye.
3) Emkhakheni wezinsalela zamasiko, ukuhlanzwa kwezinsalela zensimbi nezetshe kanye nezindawo zephepha kuyadingeka ukuze kususwe ukungcola okufana nokungcola kanye namabala ayinki avela ebusweni bawo ngenxa yomlando wawo omude. Lezi zinsalela zidinga ukususwa ukuze kubuyiselwe izinsalela. Emisebenzini yephepha efana ne-calligraphy kanye nemidwebo, uma igcinwe ngendlela engafanele, isikhunta sikhula ebusweni baso futhi sakhe amabala. La mabala athinta kakhulu ukubukeka kwasekuqaleni kwephepha, ikakhulukazi ephepheni elinenani eliphezulu lamasiko noma lomlando, okuzothinta ukwamukelwa nokuvikelwa kwalo. UZhao Ying nabanye bafunde ukuthi kungenzeka yini ukusebenzisa i-ultraviolet laser ukuhlanza amabala esikhunta emiqulwini yamaphepha. Imiphumela yokuhlola ibonise ukuthi ukusebenzisa i-laser enamandla angu-3.2 J/mm2 ukuskena kanye kungasusa amabala amancane, kanti ukuskena kabili kungasusa amabala ngokuphelele. Kodwa-ke, uma amandla e-laser asetshenziswayo ephezulu kakhulu, azolimaza umqulu wephepha ngenkathi esusa amabala. UZhang Xiaotong nabanye babuyisele ngempumelelo i-relic yethusi eqoshiwe besebenzisa indlela ye-laser vertical irradiation liquid film. UZhang Licheng nabanye. basebenzise ubuchwepheshe bokuhlanza nge-laser ekubuyiselweni kwesifanekiso sobumba sabesifazane esidwetshwe ngoMbuso kaHan. UYuan Xiaodong nabanye bafunde umphumela wobuchwepheshe bokuhlanza nge-laser ekuhlanzweni kwezinsalela zamatshe futhi baqhathanisa umonakalo emzimbeni wetshe lesihlabathi ngaphambi nangemva kokuhlanza, kanye nemiphumela yokuhlanza kwamabala kayinki, ukungcola kwentuthu, kanye nokungcola kopende.
Isiphetho: Ubuchwepheshe bokuhlanza i-laser buyindlela ethuthukisiwe, enocwaningo olubanzi kanye namathuba okusebenzisa emikhakheni enembile kakhulu njengezindiza, imishini yezempi, kanye nobunjiniyela be-elekthronikhi kanye nogesi. Njengamanje, ubuchwepheshe bokuhlanza i-laser busetshenziswe ngempumelelo kwezinye izindawo, ngenxa yokusebenza kwayo okusebenzayo, okunobungani nemvelo, kanye nokusebenza kahle kokuhlanza. Izindawo zokusebenzisa ziyanda kancane kancane. Ukuthuthukiswa kobuchwepheshe bokuhlanza i-laser akugcini nje ngokusetshenziswa ngokuvuthwa ezindaweni ezifana nokususwa kopende nokususwa kokugqwala, kodwa futhi kube nemibiko yokusebenzisa i-laser ukuhlanza ungqimba lwe-oxide ezintanjeni zensimbi eminyakeni yamuva nje. Ukwandiswa kwamasimu okusebenzisa akhona kanye nokuthuthukiswa kwamasimu amasha kuyisisekelo sokuthuthukiswa kobuchwepheshe bokuhlanza i-laser. Ucwaningo kanye nokuthuthukiswa kwemishini emisha yokuhlanza i-laser kanye nokuthuthukiswa kwemishini emisha yokuhlanza i-laser kuzobonisa umehluko, okuholela emisebenzini eyahlukahlukene. Esikhathini esizayo, ukufeza ukuhlanzwa kwe-laser okuzenzakalelayo ngokugcwele ngokubambisana namarobhothi ezimboni nakho kungafezeka. Umkhuba wokuthuthukiswa kobuchwepheshe bokuhlanza i-laser umi kanje:
(1) Ukuqinisa ucwaningo ngethiyori yokuhlanza nge-laser ukuze kuqondiswe ukusetshenziswa kobuchwepheshe bokuhlanza nge-laser. Ngemva kokubukeza inani elikhulu lemibhalo, kutholakale ukuthi alukho uhlelo lwethiyori oluvuthiwe olusekela ubuchwepheshe bokuhlanza nge-laser, futhi izifundo eziningi zisekelwe ekuhlolweni. Ukusungula uhlelo lwethiyori yokuhlanza nge-laser kuyisisekelo sentuthuko eyengeziwe kanye nokuvuthwa kobuchwepheshe bokuhlanza nge-laser.
(2) Ukwandiswa kwamasimu okusetshenziswa akhona kanye namasimu okusetshenziswa amasha. Ubuchwepheshe bokuhlanza nge-laser busetshenziswe ngempumelelo ezindaweni ezifana nokususwa kopende kanye nokususwa kokugqwala, futhi kube nemibiko yokusebenzisa i-laser ukuhlanza ungqimba lwe-oxide ezintanjeni zensimbi eminyakeni yamuva nje. Ukwandiswa kwamasimu okusetshenziswa akhona kanye nokuthuthukiswa kwamasimu amasha kuyinhlabathi evundile yokuthuthukiswa kobuchwepheshe bokuhlanza nge-laser.
(3) Ucwaningo kanye nokuthuthukiswa kwemishini emisha yokuhlanza nge-laser. Ukuthuthukiswa kwemishini emisha yokuhlanza nge-laser kuzobonisa umehluko. Uhlobo olulodwa imishini enobubanzi obuthile obuhlanganisa amasimu amaningi okusetshenziswa, njengokuthi idivayisi eyodwa ingafeza imisebenzi yokususa upende kanye nokususa ukugqwala ngasikhathi sinye. Olunye uhlobo imishini ekhethekile yezidingo ezithile, njengokuklama izinto ezithile noma imicu ye-optical ukuze kufezwe umsebenzi wokuhlanza ukungcola ezindaweni ezincane. Ngokubambisana namarobhothi ezimboni, ukuhlanza nge-laser okuzenzakalelayo ngokuphelele nakho kuyindlela ethandwayo yokusetshenziswa.
Isikhathi sokuthunyelwe: Julayi-17-2025
