Nakuba ama-lasers asheshayo kade ekhona amashumi eminyaka, izicelo zezimboni zikhule ngokushesha kule minyaka engamashumi amabili edlule. Ngo-2019, inani lemakethe le-Ultrafastizinto ze-laserukucubungula bekulinganiselwa ezigidini ezingama-US $460, nezinga lokukhula elihlanganisiwe lonyaka lika-13%. Izindawo zokufaka izicelo lapho ama-laser e-ultrafast asetshenziswe ngempumelelo ukucubungula izinto ezisetshenziswa ezimbonini zihlanganisa ukwenziwa kwesithombe se-photomask kanye nokulungiswa embonini ye-semiconductor kanye nokudayela kwe-silicon, ukusika ingilazi/ukubhala kanye (i-indium tin oxide) nokususwa kwefilimu ye-ITO kuma-electronics abathengi njengamaselula namathebulethi. , umbhalo we-piston wemboni yezimoto, ukukhiqizwa kwe-coronary stent kanye nokukhiqizwa kwemishini ye-microfluidic embonini yezokwelapha.
01 Ukukhiqiza nokulungisa i-Photomask embonini ye-semiconductor
Ama-laser asheshayo asetshenziswe kwesinye sezicelo zokuqala zezimboni ekucubunguleni izinto. I-IBM ibike ukusetshenziswa kwe-femtosecond laser ablation ekukhiqizeni i-photomask ngeminyaka yawo-1990. Uma kuqhathaniswa nokukhishwa kwe-laser ye-nanosecond, engakhiqiza i-spatter yensimbi kanye nokulimala kwengilazi, imaski ye-laser ye-femtosecond ayibonisi isiphalaphala sensimbi, akukho monakalo wengilazi, njll. Izinzuzo. Le ndlela isetshenziselwa ukukhiqiza amasekhethi ahlanganisiwe (ICs). Ukukhiqiza i-IC chip kungase kudinge imaski efinyelela kwangu-30 futhi kubiza u-$100,000. I-Femtosecond laser processing ingacubungula imigqa namaphoyinti ngaphansi kuka-150nm.
Umfanekiso 1. Ukwenziwa nokulungisa imaski yesithombe
Umfanekiso 2. Imiphumela yokuthuthukisa yamaphethini e-mask ahlukene we-ultraviolet lithography eyeqisayo
02 Ukusika i-silicon embonini ye-semiconductor
I-Silicon wafer dicing iyinqubo evamile yokukhiqiza embonini ye-semiconductor futhi ngokuvamile yenziwa kusetshenziswa ukudayela kwemishini. Lawa masondo okusika avame ukwenza ama-microcracks futhi kunzima ukusika ama-wafer azacile (isb. Ukusika i-laser yama-silicon wafers sekusetshenziswe iminyaka eminingi embonini ye-semiconductor, ikakhulukazi kuma-wafers amancane (100-200μm), futhi kwenziwa ngezinyathelo eziningi: i-laser grooving, elandelwa ukuhlukaniswa komshini noma ukusika okuyimfihlo (okungukuthi i-infrared laser beam ngaphakathi. i-silicon scribing) kulandelwa ukuhlukaniswa kwe-tape mechanical. I-nanosecond pulse laser ingacubungula amawafa ayi-15 ngehora, kanti i-piccosecond laser ingacubungula amawafa angama-23 ngehora, ngekhwalithi ephezulu.
03 Ukusika/ukubhala ingilazi embonini ye-elekthronikhi esetshenziswayo
Izikrini zokuthinta nezingilazi zokuvikela zamaselula namakhompyutha aphathekayo ziya ziba mncane futhi ezinye izimo zejiyomethri zigobile. Lokhu kwenza ukusika ngomshini wendabuko kube nzima kakhulu. Amalaser ajwayelekile ngokuvamile akhiqiza ikhwalithi embi yokusikwa, ikakhulukazi uma lezi zibonisi zengilazi zinqwabelene izendlalelo ezingu-3-4 futhi ingilazi yokuvikela ephezulu engu-700 μm enogqinsi, engaphuka ngengcindezi yendawo. Ama-laser asheshayo aboniswe ukuthi ayakwazi ukusika lezi zibuko ngamandla angcono onqenqema. Ngokusikwa kwephaneli enkulu eyisicaba, i-laser ye-femtosecond ingagxila endaweni engemuva yeshidi lengilazi, inwaya ingaphakathi lengilazi ngaphandle kokulimaza indawo engaphambili. Ingilazi ingase yephulwe kusetshenziswa izindlela zemishini noma ezishisayo eduze kwephethini yamaphuzu.
Umfanekiso 3. Picosecond ultrafast laser glass ukusika okumise okukhethekile
04 Ukwakheka kwePiston embonini yezimoto
Izinjini zezimoto ezingasindi zenziwe ngama-alloys e-aluminium, angakwazi ukumelana nensimbi njengensimbi. Ucwaningo luthole ukuthi i-femtosecond laser processing ye-car piston textures inganciphisa ukungqubuzana kufika ku-25% ngoba udoti namafutha kungagcinwa ngempumelelo.
Umfanekiso 4. I-Femtosecond laser processing yamapiston enjini yemoto ukuze kuthuthukiswe ukusebenza kwenjini
05 Ukukhiqizwa kwama-stent e-Coronary embonini yezokwelapha
Izigidi zama-coronary stents zifakwa emithanjeni yenhliziyo ukuze kuvuleke umgudu ukuze igazi ligelezele emithanjeni ejiyile ngenye indlela, okusindisa izigidi zabantu minyaka yonke. Ama-coronary stents enziwa ngensimbi (isb., insimbi engagqwali, ingxubevange yenkumbulo yomumo we-nickel-titanium, noma ingxubevange ye-cobalt-chromium yakamuva) enezintambo ezinobubanzi obucishe bube ngu-100 μm. Uma kuqhathaniswa nokusika kwe-laser ye-pulse ende, izinzuzo zokusebenzisa ama-laser asheshayo ukusika abakaki izinga eliphezulu lokusika, ukuqedwa okungcono kwendawo, kanye nemfucumfucu encane, okunciphisa izindleko zangemuva kokucubungula.
06 Ukwenziwa kwemishini ye-Microfluidic embonini yezokwelapha
Amadivaysi e-Microfluidic avame ukusetshenziswa embonini yezokwelapha ukuhlola izifo nokuxilongwa. Lokhu kuvame ukukhiqizwa ngokubumba komjovo omncane wezingxenye ngazinye bese kubophana kusetshenziswa i-gluing noma i-welding. Ukwenziwa kwe-laser esheshayo yamadivayisi we-microfluidic kunenzuzo yokukhiqiza iziteshi ezincane ze-3D ngaphakathi kwezinto ezibonakalayo ezifana nengilazi ngaphandle kwesidingo sokuxhuma. Enye indlela ukwakhiwa kwe-laser esheshayo ngaphakathi kwengilazi eyinqwaba elandelwa ukufakwa kwamakhemikhali amanzi, kanti enye i-femtosecond laser ablation ngaphakathi kwengilazi noma ipulasitiki emanzini acwecwe ukuze kukhishwe imfucumfucu. Enye indlela ukufaka amashaneli omshini endaweni engilazi bese uwavala ngesembozo sengilazi usebenzisa i-femtosecond laser welding.
Umfanekiso 6. I-Femtosecond laser-induced selective etching ukuze kulungiswe iziteshi ezincane ezingaphakathi kwengilazi.
07 Ukubhoboza okuncane komlomo womjovo
I-Femtosecond laser microhole machining ithathe indawo ye-micro-EDM ezinkampanini eziningi ezimakethe zokujova ezinomfutho omkhulu ngenxa yokuguquguquka okukhulu ekushintsheni amaphrofayili embobo yokugeleza kanye nezikhathi ezimfishane zokuwenza. Ikhono lokulawula ngokuzenzakalelayo indawo okugxilwe kuyo kanye nokutsheka kwe-beam ngekhanda lokuskena kwangaphambilini liholele ekwakhiweni kwamaphrofayili wokuvula (isb, umgqomo, ukuvuleka, ukuhlangana, ukuhlukana) okungakhuthaza ukwenziwa kwe-atom noma ukungena egumbini elivuthayo. Isikhathi sokubhoboza sincike kumthamo wokukhipha, ngogqinsi lwe-drill engu-0.2 – 0.5 mm nobubanzi bembobo obungu-0.12 – 0.25 mm, okwenza le nqubo isheshe ngokuphindwe kashumi kune-micro-EDM. I-Microdrilling yenziwa ngezigaba ezintathu, okuhlanganisa ukugoqa nokuqedwa kwezimbobo zokuhlola. I-Argon isetshenziswa njengegesi elisizayo ukuvikela i-borehole kusuka ku-oxidation nokuvikela i-plasma yokugcina phakathi nezigaba zokuqala.
Umfanekiso 7. I-Femtosecond laser processing ephezulu yokunemba kwembobo ye-taper ehlanekezelwe yomjovo wenjini yedizili
08 Umbhalo we-laser oshesha kakhulu
Eminyakeni yamuva, ukuze kuthuthukiswe ukunemba kwemishini, ukunciphisa umonakalo wezinto ezibonakalayo, nokwandisa ukusebenza kahle kokucubungula, umkhakha we-micromachining kancane kancane usugxile kubacwaningi. I-Ultrafast laser inezinzuzo ezihlukahlukene zokucubungula ezifana nokulimala okuphansi nokunemba okuphezulu, okuye kwaba ukugxila ekukhuthazeni ukuthuthukiswa kobuchwepheshe bokucubungula. Ngasikhathi sinye, ama-laser e-ultrafast angasebenza ezintweni ezahlukahlukene, futhi ukulimala kwezinto zokucubungula i-laser nakho kuyisiqondiso esikhulu socwaningo. I-Ultrafast laser isetshenziselwa ukucisha izinto. Uma ukuminyana kwamandla we-laser kungaphezulu komkhawulo wokukhipha wento, ingaphezulu lempahla esusiwe izobonisa isakhiwo se-micro-nano esinezici ezithile. Ucwaningo lubonisa ukuthi lesi Sakhiwo sendawo ekhethekile siyisenzakalo esivamile esenzeka lapho izinto zokucubungula i-laser. Ukulungiswa kwezakhiwo ze-surface micro-nano kungathuthukisa izakhiwo zezinto ngokwazo futhi kunikeze amandla ukuthuthukiswa kwezinto ezintsha. Lokhu kwenza ukulungiswa kwezakhiwo ze-surface micro-nano nge-laser esheshayo kube indlela yobuchwepheshe enokubaluleka kokuthuthukiswa okubalulekile. Njengamanje, mayelana nezinto zensimbi, ucwaningo lwe-ultrafast laser surface texturing lungathuthukisa izakhiwo zokumanzisa indawo yensimbi, luthuthukise ukungqubuzana kwendawo kanye nezakhiwo zokugqokwa, luthuthukise ukunamathela kokunamathela, nokwanda okuqondile nokunamathela kwamaseli.
Umfanekiso 8. Izakhiwo ze-Superhydrophobic ze-silicon elungiselelwe nge-laser
Njengobuchwepheshe bokucubungula onqenqemeni, ukucutshungulwa kwe-laser okune-ultrafast kunezici zendawo encane ethintekile ekushiseni, inqubo engeyona yomugqa yokusebenzisana nezinto zokwakha, kanye nokucubungula okuphezulu okungaphezu komkhawulo wokuhlukanisa. Ingabona ukucutshungulwa kwe-micro-nano kwekhwalithi ephezulu nokunemba okuphezulu kwezinto ezahlukahlukene. kanye nokwakhiwa kwesakhiwo se-micro-nano esinezinhlangothi ezintathu. Ukuzuza ukukhiqizwa kwe-laser kwezinto ezikhethekile, izakhiwo eziyinkimbinkimbi namadivayisi akhethekile kuvula izindlela ezintsha zokukhiqiza ama-micro-nano. Njengamanje, i-laser ye-femtosecond isetshenziswe kabanzi emikhakheni eminingi yesayensi esezingeni eliphezulu: i-laser ye-femtosecond ingasetshenziswa ukulungisa amadivaysi ahlukahlukene optical, njengama-microlens arrays, amehlo ahlanganisiwe e-bionic, ama-waveguides optical kanye nama-metasurfaces; isebenzisa ukunemba kwayo okuphezulu, ukulungiswa okuphezulu kanye Namakhono okucubungula ama-three-dimensional, i-laser ye-femtosecond ingalungisa noma ihlanganise ama-chips e-microfluidic kanye ne-optofluidic afana nezingxenye ze-microheater kanye namashaneli e-microfluidic anezinhlangothi ezintathu; ngaphezu kwalokho, i-laser ye-femtosecond ingase futhi ilungiselele izinhlobo ezahlukene ze-surface micro-nanostructures ukuze kuzuzwe i-anti-reflection, i-anti-reflection, i-super-hydrophobic, i-anti-icing neminye imisebenzi; hhayi lokho kuphela, i-laser ye-femtosecond nayo isetshenzisiwe emkhakheni we-biomedicine, okubonisa ukusebenza okuvelele emikhakheni efana ne-biological micro-stents, ama-cell culture substrates kanye ne-biological microscopic imaging. Amathemba abanzi wokufaka isicelo. Njengamanje, izinkambu zokusetshenziswa kwe-femtosecond laser processing ziyakhula unyaka nonyaka. Ngaphezu kwalezi zinto ezishiwo ngenhla, ama-micro-optics, ama-micro-nanostructures anemisebenzi eminingi kanye nezicelo zobunjiniyela be-biomedical, futhi idlala indima enkulu kwezinye izinkambu ezisafufusa, ezifana nokulungiselela i-metasurface. , ukukhiqizwa kwe-micro-nano kanye nokugcinwa kolwazi lwe-multi-dimensional optical, njll.
Isikhathi sokuthumela: Apr-17-2024
