Nakuba ama-laser e-ultrafast abe khona amashumi eminyaka, ukusetshenziswa kwezimboni kukhule ngokushesha eminyakeni engamashumi amabili edlule. Ngo-2019, inani lemakethe le-ultrafastizinto ze-laserukucubungula bekucishe kube yizigidi ezingama-US$460, ngesilinganiso sokukhula saminyaka yonke esihlanganisiwe esingu-13%. Izindawo zokusetshenziswa lapho ama-laser asheshayo asetshenziswe khona ngempumelelo ukucubungula izinto zezimboni zifaka phakathi ukwenziwa nokulungiswa kwe-photomask embonini ye-semiconductor kanye nokususwa kwe-silicon, ukusika/ukubhala ngengilazi kanye nokususwa kwefilimu ye-ITO kuma-electronics asetshenziswa ngabathengi njengamaselula namathebulethi, ukuthunga kwe-piston embonini yezimoto, ukukhiqizwa kwe-coronary stent kanye nokukhiqizwa kwamadivayisi e-microfluidic embonini yezokwelapha.
01 Ukukhiqizwa nokulungiswa kwe-Photomask embonini ye-semiconductor
Ama-laser e-Ultrafast asetshenziswa kwenye yezicelo zokuqala zezimboni ekucubungulweni kwezinto. I-IBM ibike ukusetshenziswa kwe-femtosecond laser ablation ekukhiqizweni kwe-photomask ngawo-1990. Uma kuqhathaniswa ne-nanosecond laser ablation, engadala umonakalo wensimbi kanye nengilazi, ama-femtosecond laser masks awabonisi umonakalo wensimbi, umonakalo wengilazi, njll. Izinzuzo. Le ndlela isetshenziselwa ukukhiqiza amasekethe ahlanganisiwe (ama-IC). Ukukhiqiza i-IC chip kungadinga ama-masks afinyelela ku-30 futhi kubize ngaphezulu kuka-$100,000. Ukucubungula i-Femtosecond laser kungacubungula imigqa namaphuzu angaphansi kuka-150nm.
Umfanekiso 1. Ukwenziwa nokulungiswa kwe-Photomask
Umfanekiso 2. Imiphumela yokwenza ngcono amaphethini ahlukene emaski ukuze kutholakale ukukhanya okukhulu kwe-ultraviolet
02 Ukusikwa kwe-silicon embonini ye-semiconductor
Ukusika i-silicon wafer kuyinqubo ejwayelekile yokukhiqiza embonini ye-semiconductor futhi ngokuvamile kwenziwa ngokusebenzisa ukusika ngomshini. Lawa masondo okusika avame ukuba nemifantu emincane futhi kunzima ukuwasika abe mancane (isb. ukujiya < 150 μm). Ukusika i-silicon wafer nge-laser kuye kwasetshenziswa embonini ye-semiconductor iminyaka eminingi, ikakhulukazi kuma-wafer amancane (100-200μm), futhi kwenziwa ngezinyathelo eziningi: ukuhlikihla nge-laser, kulandelwe ukuhlukaniswa ngomshini noma ukusika okuyimfihlo (okungukuthi, umsebe we-laser we-infrared ngaphakathi kwe-silicon scribing) kulandelwe ukuhlukaniswa kwetheyiphu ngomshini. I-nanosecond pulse laser ingacubungula ama-wafer angu-15 ngehora, kanti i-picosecond laser ingacubungula ama-wafer angu-23 ngehora, ngekhwalithi ephezulu.
03 Ukusika/ukubhala ngengilazi embonini ye-elekthronikhi esetshenziswayo
Izikrini zokuthinta kanye nezibuko zokuvikela zamafoni aphathwayo kanye nama-laptop ziya ngokuya zincipha futhi ezinye izimo zejometri ziyagoba. Lokhu kwenza ukusika okwenziwa ngomshini kwendabuko kube nzima kakhulu. Ama-laser ajwayelekile avame ukukhiqiza ikhwalithi yokusika engeyinhle, ikakhulukazi uma lezi zibonisi zeglasi zibekwe izingqimba ezingu-3-4 futhi ingilazi yokuvikela ephezulu engu-700 μm ithambile, engaphuka ngokucindezeleka kwendawo. Ama-laser asheshayo aboniswe ukuthi akwazi ukusika lezi zingilazi ngamandla angcono onqenqemeni. Ekusikeni kwephaneli elikhulu eliyisicaba, i-laser ye-femtosecond ingagxila ebusweni bangemuva beshidi lengilazi, iklwebhe ingaphakathi lengilazi ngaphandle kokulimaza ubuso bangaphambili. Ingilazi ingabe isiphukile kusetshenziswa izindlela zomshini noma zokushisa ngokwephethini eqoshiwe.
Umfanekiso 3. Ukusika okunesimo esikhethekile sengilazi ye-laser ye-Picosecond ultrafast
04 Ukuthungwa kwe-piston embonini yezimoto
Izinjini zezimoto ezilula zenziwe ngama-alloy e-aluminium, angagugi njengensimbi ephonswe ngensimbi. Ucwaningo luthole ukuthi ukucutshungulwa kwe-femtosecond laser kwe-car piston textures kunganciphisa ukungqubuzana ngamaphesenti afinyelela ku-25 ngoba udoti namafutha kungagcinwa ngempumelelo.
Umfanekiso 4. Ukucutshungulwa kwe-femtosecond laser kwama-piston enjini yezimoto ukuthuthukisa ukusebenza kwenjini
05 Ukukhiqizwa kwe-Coronary stent embonini yezokwelapha
Izigidi zama-coronary stents zifakwa emithanjeni yenhliziyo yomzimba ukuze kuvulwe umzila wegazi ukuze ligeleze emithanjeni yegazi evalekile, okusindisa izigidi zezimpilo minyaka yonke. Ama-coronary stents ngokuvamile enziwa ngensimbi (isb., insimbi engagqwali, i-nickel-titanium shape memory alloy, noma i-cobalt-chromium alloy yakamuva) enobubanzi be-strut obungaba ngu-100 μm. Uma kuqhathaniswa nokusika kwe-laser ye-long-pulse, izinzuzo zokusebenzisa ama-laser asheshayo ukusika ama-bracket yikhwalithi ephezulu yokusika, ukuqeda okungcono kwendawo, kanye nokungcola okuncane, okunciphisa izindleko zangemva kokucubungula.
06 Ukukhiqizwa kwamadivayisi e-Microfluidic embonini yezokwelapha
Amadivayisi e-Microfluidic avame ukusetshenziswa embonini yezokwelapha ukuhlola nokuxilongwa kwezifo. Lawa avame ukukhiqizwa ngokubumba nge-micro-injection yezingxenye ngazinye bese kuba ukubopha kusetshenziswa i-gluing noma i-welding. Ukwenziwa kwe-Ultrafast laser kwamadivayisi e-microfluidic kunenzuzo yokukhiqiza iziteshi ezincane ze-3D ngaphakathi kwezinto ezibonakalayo njengengilazi ngaphandle kwesidingo sokuxhumeka. Enye indlela ukwenziwa kwe-ultrafast laser ngaphakathi kwengilazi enkulu kulandelwe ukuqoshwa kwamakhemikhali okumanzi, kanti enye i-femtosecond laser ablation ngaphakathi kwengilazi noma epulasitiki emanzini acwengekile ukuze kususwe udoti. Enye indlela ukufaka iziteshi ngomshini ebusweni bengilazi bese uzivala ngesembozo sengilazi nge-femtosecond laser welding.
Umfanekiso 6. Ukuqopha okukhethwayo okubangelwa yi-laser ye-Femtosecond ukulungiselela iziteshi ze-microfluidic ngaphakathi kwezinto zengilazi
07 Ukubhoboza okuncane kwe-nozzle ye-injector
Umshini wokugaya i-laser microhole we-Femtosecond uthathe indawo ye-micro-EDM ezinkampanini eziningi emakethe ye-injector enomfutho ophezulu ngenxa yokuguquguquka okukhulu ekushintsheni amaphrofayili emigodi yokugeleza kanye nezikhathi ezimfushane zomshini. Amandla okulawula ngokuzenzakalelayo indawo yokugxila kanye nokuthambekela kogongolo ngekhanda lokuskena eliqhubekayo kuholele ekwakhiweni kwamaphrofayili okuvula (isb., umgqomo, ukuvuleka, ukuhlangana, ukuhlukana) okungakhuthaza i-atomization noma ukungena ekamelweni lokushisa. Isikhathi sokubhoboza sincike kuvolumu yokukhipha, enobukhulu bokubhoboza obungu-0.2 - 0.5 mm kanye nobubanzi bemigodi obungu-0.12 - 0.25 mm, okwenza le ndlela isheshe ngokuphindwe kayishumi kune-micro-EDM. Umshini wokugaya i-micro wenziwa ngezigaba ezintathu, okuhlanganisa ukugoqa kanye nokuqedwa kwemigodi ye-through-pilot. I-Argon isetshenziswa njengegesi elisizayo ukuvikela imbobo ekushiseni nasekuvikeleni i-plasma yokugcina phakathi nezigaba zokuqala.
Umfanekiso 7. Ukucutshungulwa ngokunemba okuphezulu kwe-laser ye-Femtosecond yembobo ye-taper eguquliwe ye-injector yenjini yedizili
08 Ukuthunga nge-laser okusheshayo kakhulu
Eminyakeni yamuva nje, ukuze kuthuthukiswe ukunemba komshini, kuncishiswe umonakalo wezinto ezibonakalayo, futhi kwandiswe ukusebenza kahle kokucubungula, insimu ye-micromachining iye yaba yinto egxilwe kakhulu abacwaningi. I-Ultrafast laser inezinzuzo ezahlukahlukene zokucubungula njengomonakalo ophansi kanye nokunemba okuphezulu, okuye kwaba yinto egxile ekukhuthazeni ukuthuthukiswa kobuchwepheshe bokucubungula. Ngesikhathi esifanayo, ama-ultrafast laser angasebenza ezintweni ezahlukahlukene, futhi umonakalo wezinto zokucubungula nge-laser nawo uyisiqondiso esikhulu socwaningo. I-Ultrafast laser isetshenziselwa ukususa izinto ezibonakalayo. Lapho ubukhulu bamandla be-laser buphakeme kunomkhawulo wokususa wezinto ezibonakalayo, ubuso bezinto ezibonakalayo buzobonisa isakhiwo se-micro-nano esinezici ezithile. Ucwaningo lubonisa ukuthi lesi Sakhiwo esikhethekile sobuso siyinto evamile eyenzeka lapho kucubungula izinto nge-laser. Ukulungiswa kwezakhiwo ze-micro-nano zobuso kungathuthukisa izakhiwo zezinto ngokwazo futhi kuvumele ukuthuthukiswa kwezinto ezintsha. Lokhu kwenza ukulungiswa kwezakhiwo ze-micro-nano zobuso nge-ultrafast laser kube yindlela yobuchwepheshe enokubaluleka okubalulekile kwentuthuko. Njengamanje, ngezinto zensimbi, ucwaningo mayelana nokwakheka kobuso be-laser okusheshayo lungathuthukisa izakhiwo zokumanzisa ubuso bensimbi, luthuthukise ukungqubuzana kobuso kanye nezakhiwo zokuguguleka, luthuthukise ukunamathela kokumboza, kanye nokwanda nokunamathela kwamaseli ngendlela eqondisayo.
Umfanekiso 8. Izakhiwo ze-superhydrophobic zobuso be-silicon obulungiselelwe nge-laser
Njengobuchwepheshe bokucubungula obusezingeni eliphezulu, ukucubungula i-laser okusheshayo kunezimpawu zendawo encane ethintekile ekushiseni, inqubo engaqondile yokusebenzisana nezinto, kanye nokucubungula okunesinqumo esiphezulu ngaphezu komkhawulo wokusabalalisa. Ingafeza ukucutshungulwa kwe-micro-nano okuseqophelweni eliphezulu nokunembile kwezinto ezahlukahlukene. kanye nokwakhiwa kwesakhiwo se-micro-nano esinobukhulu obuthathu. Ukufeza ukukhiqizwa kwe-laser kwezinto ezikhethekile, izakhiwo eziyinkimbinkimbi namadivayisi akhethekile kuvula izindlela ezintsha zokukhiqizwa kwe-micro-nano. Njengamanje, i-femtosecond laser isetshenziswe kabanzi emikhakheni eminingi yesayensi esezingeni eliphezulu: i-femtosecond laser ingasetshenziswa ukulungiselela amadivayisi ahlukahlukene optical, njenge-microlens arrays, i-bionic compound eyes, ama-optical waveguides kanye ne-metasurfaces; isebenzisa ukunemba kwayo okuphezulu, isinqumo esiphezulu kanye Namakhono okucubungula anobukhulu obuthathu, i-femtosecond laser ingalungiselela noma ihlanganise ama-microfluidic kanye nama-optofluidic chips njengezingxenye ze-microheater kanye neziteshi ze-microfluidic ezinobukhulu obuthathu; Ngaphezu kwalokho, i-femtosecond laser ingalungiselela nezinhlobo ezahlukene zezakhiwo ezincane ze-surface ukuze kufezwe imisebenzi yokulwa nokukhanya, ukulwa nokukhanya, i-super-hydrophobic, i-anti-icing neminye; hhayi lokho kuphela, i-femtosecond laser nayo isetshenziswe emkhakheni we-biomedicine, ikhombisa ukusebenza okuhle kakhulu emikhakheni efana ne-biological micro-stents, i-cell culture substrates kanye ne-biological microscopic imaging. Amathemba okusetshenziswa okubanzi. Njengamanje, izinkambu zokusetshenziswa kokucubungula i-femtosecond laser ziyanda unyaka nonyaka. Ngaphezu kwe-micro-optics eshiwo ngenhla, i-microfluidics, i-micro-nanostructures enemisebenzi eminingi kanye nezinhlelo zokusebenza zobunjiniyela bezokwelapha, idlala indima enkulu kweminye imikhakha esanda kuvela, njengokulungiselela i-metasurface. , ukukhiqizwa kwe-micro-nano kanye nokugcinwa kolwazi lwe-optical olunezilinganiso eziningi, njll.
Isikhathi sokuthunyelwe: Ephreli-17-2024
